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Feature

2008

2009

2010

Structure

 

 

 

Sequential Build-up

1+N+1

1+N+1

2+N+2(IVH)

Layer Count

16

20

24

Board Thickness (Min)

12

12

10

Board Thickness (Max)

160

175

175

Via in Pad

No

No

Yes

Material

 

 

 

Copper foil outer layer

1/2oz-2oz

1/3oz-3oz

1/3oz-6oz

Copper foil inner layer

1/2oz-2oz

1/3oz-3oz

1/3oz-6oz

Solder Mask

 

 

 

Solder Mask Dam (Min)

2.5 mil

2.5 mil

2 mil

Solder Mask Opening (Min)

2 mil

2 mil

1.5 mil

Dielectric thickness

 

 

 

Core thickness (Min)

4 mil

3 mil

2 mil

Dielectric thickness (prepreg)

2 mil

2 mil

2 mil

Registration Capability

 

 

 

Layer to Layer

3 mil

3 mil

3 mil

Plating Capability

 

 

 

Aspect Ratio (Mechanical)

8:1

10:1

12:1

Aspect Ratio (Laser)

0.7:1

0.7:1

1:1

Electrical/RF Capability

 

 

 

Min line width/space (Inner 1/2 oz)

3mil/3mil

2mil/3mil

2mil/2mil

Min line width/space (Inner 1 oz)

3mil/3mil

3mil/3mil

3mil/3mil

Min line width/space (Outer 1/2 oz)

3mil/3mil

3mil/3mil

2.5mil/2.5mil

Impedance Control

+-10%

+-8%

+-6%

Surface Finished

 

 

 

Organic Solderability Preservative

Yes

Yes

Yes

Electroless Nickel / immersion gold

Yes

Yes

Yes

Immersion Silver

Yes

Yes

Yes

Immersion Tin

No

Yes

Yes

Lead Free HAL

Yes

Yes

Yes

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