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     MICRO-VIA TECHNOLOGY  
     Description:   4 to 12 layers
     Base Material:   FR4 Prepreg or Laser drillable Prepreg 
     Min. Board Thickness : 16 mils (4 layers) 
     Min. Line/Spacing : 4/4 mils
     Min. Hole Size :    4 mils (laser) 
     Surface Finish :    OSP, HASL, Immersion Gold, Immersion Silver, Immersion Tin
     Drilling Method:   CO2 Laser Drilling
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