Chinese English
Your Position: Home >> PCB Solutions
Advance Technology
     MICRO-VIA TECHNOLOGY  
     Description:   4 to 12 layers
     Base Material:   FR4 Prepreg or Laser drillable Prepreg 
     Min. Board Thickness : 16 mils (4 layers) 
     Min. Line/Spacing : 4/4 mils
     Min. Hole Size :    4 mils (laser) 
     Surface Finish :    OSP, HASL, Immersion Gold, Immersion Silver, Immersion Tin
     Drilling Method:   CO2 Laser Drilling
Back Print
Worldwide Sales Network
Related Linkage
2010 Jeter Electronics Limited All Rights Reserved  TEL: +86-755-86652158  FAX: +86-755-86652159