Technology Roadmap-PCB Solutions-Jeter Electronics Limited


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Technology Roadmap

Technology	2009	2010 to 2011
Finished Hole Size
Mechanical Drill Size
>= 10 mils
= 8 mils
Control Impedence
+/- 10%
+/- 8%
Stack Via (Laser)
Epoxy Filled Vias
Fill Vias by Plating
Materials
Normal FR4 (Tg 135°C to 170°C)
Lead-Free FR4 (Tg 150°C to 170°C)
Halogen-Free FR4 (Tg 150°C to 170°C)
Microvia Type
2 + 2 with Buried Hole (Staggered)
2 + 2 with Buried Hole (Stack-up)
3 + 3 with Buried Hole (Stack-up)
Through/Buried hole Aspect Ratio (Mechanical)
8 : 1
10 : 1
Blind Hole Aspect Ratio(Laser)
0.5 : 1
0.85 : 1
Line/Space
4/4 mils
3/3 mils
Layers
14 Layers
20 Layers

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