|
|
|
| Capabilities |
|
|
2008
|
2009
|
2010
|
|
Structure
|
|
|
|
|
Sequential Build-up
|
1+N+1
|
1+N+1
|
2+N+2(IVH)
|
|
Layer Count
|
16
|
20
|
24
|
|
Board Thickness (Min)
|
12
|
12
|
10
|
|
Board Thickness (Max)
|
160
|
175
|
175
|
|
Via in Pad
|
No
|
No
|
Yes
|
|
Material
|
|
|
|
|
Copper foil outer layer
|
1/2oz-2oz
|
1/3oz-3oz
|
1/3oz-6oz
|
|
Copper foil inner layer
|
1/2oz-2oz
|
1/3oz-3oz
|
1/3oz-6oz
|
|
Solder Mask
|
|
|
|
|
Solder Mask Dam (Min)
|
2.5 mil
|
2.5 mil
|
2 mil
|
|
Solder Mask Opening (Min)
|
2 mil
|
2 mil
|
1.5 mil
|
|
Dielectric thickness
|
|
|
|
|
Core thickness (Min)
|
4 mil
|
3 mil
|
2 mil
|
|
Dielectric thickness (prepreg)
|
2 mil
|
2 mil
|
2 mil
|
|
Registration Capability
|
|
|
|
|
Layer to Layer
|
3 mil
|
3 mil
|
3 mil
|
|
Plating Capability
|
|
|
|
|
Aspect Ratio (Mechanical)
|
8:1
|
10:1
|
12:1
|
|
Aspect Ratio (Laser)
|
0.7:1
|
0.7:1
|
1:1
|
|
Electrical/RF Capability
|
|
|
|
|
Min line width/space (Inner 1/2 oz)
|
3mil/3mil
|
2mil/3mil
|
2mil/2mil
|
|
Min line width/space (Inner 1 oz)
|
3mil/3mil
|
3mil/3mil
|
3mil/3mil
|
|
Min line width/space (Outer 1/2 oz)
|
3mil/3mil
|
3mil/3mil
|
2.5mil/2.5mil
|
|
Impedance Control
|
+-10%
|
+-8%
|
+-6%
|
|
Surface Finished
|
|
|
|
|
Organic Solderability Preservative
|
Yes
|
Yes
|
Yes
|
|
Electroless Nickel / immersion gold
|
Yes
|
Yes
|
Yes
|
|
Immersion Silver
|
Yes
|
Yes
|
Yes
|
|
Immersion Tin
|
No
|
Yes
|
Yes
|
|
Lead Free HAL
|
Yes
|
Yes
|
Yes
|
|
|
| 【Back】
【Print】 |
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