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Capabilities
2008
2009
2010
Structure
 
 
 
Sequential Build-up
1+N+1
1+N+1
2+N+2(IVH)
Layer Count
16
20
24
Board Thickness (Min)
12
12
10
Board Thickness (Max)
160
175
175
Via in Pad
No
No
Yes
Material
 
 
 
Copper foil outer layer
1/2oz-2oz
1/3oz-3oz
1/3oz-6oz
Copper foil inner layer
1/2oz-2oz
1/3oz-3oz
1/3oz-6oz
Solder Mask
 
 
 
Solder Mask Dam (Min)
2.5 mil
2.5 mil
2 mil
Solder Mask Opening (Min)
2 mil
2 mil
1.5 mil
Dielectric thickness
 
 
 
Core thickness (Min)
4 mil
3 mil
2 mil
Dielectric thickness (prepreg)
2 mil
2 mil
2 mil
Registration Capability
 
 
 
Layer to Layer
3 mil
3 mil
3 mil
Plating Capability
 
 
 
Aspect Ratio (Mechanical)
8:1
10:1
12:1
Aspect Ratio (Laser)
0.7:1
0.7:1
1:1
Electrical/RF Capability
 
 
 
Min line width/space (Inner 1/2 oz)
3mil/3mil
2mil/3mil
2mil/2mil
Min line width/space (Inner 1 oz)
3mil/3mil
3mil/3mil
3mil/3mil
Min line width/space (Outer 1/2 oz)
3mil/3mil
3mil/3mil
2.5mil/2.5mil
Impedance Control
+-10%
+-8%
+-6%
Surface Finished
 
 
 
Organic Solderability Preservative
Yes
Yes
Yes
Electroless Nickel / immersion gold
Yes
Yes
Yes
Immersion Silver
Yes
Yes
Yes
Immersion Tin
No
Yes
Yes
Lead Free HAL
Yes
Yes
Yes
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